Contact Us
Shenzhen Xintianma Electronics Co., Ltd.
Address: Longhua Guanlan Yijia Science and Technology Park, ShenzhenTel: 0755-83984291 83984293
Fax: 0755-22141459
EMAIL：cnxtm@cnxtm.cn
Website: http://www.cnxtm.cn
XTM-1083 Laser Cut Protective Film
Model: XTM-1083
Product parameters:
Applications: prevents workpiece cracking, edge chipping and surface burning; avoids stamp-edge irregularities and slag residue, reduces thermal damage at cut edges and improves processing quality.
- Product Details
- Contact Us
Laser cutting overview
Laser cutting focuses a high-energy-density beam through a lens near the material, melting its surface to complete the cut. Inorganic non-metallic materials such as ceramics and glass absorb almost all laser energy, but their poor thermal conductivity creates a narrow heated zone and high thermal stress along the beam path, which can cause uncontrolled fracture.
Laser Cutting Protective Film Overview
To address these challenges, we developed JY-1083 protective film for laser cutting. It quickly forms a protective layer on wafers, silicon wafers and ceramic substrates, dispersing heat to prevent cracking, chipping and surface burning. It reduces edge thermal damage and slag residue, improves accuracy, creates a smooth burr-free surface and narrow kerf, and protects the lens from spatter and fumes.
Performance features:
●Advanced Wafer Laser Slotting for Semiconductors
Laser protection solution ●for heat dissipation, heat resistance, cooling, lubrication, anti-splash
●It has excellent heat dissipation, heat resistance and cooling functions.
It ●has good lubrication performance and is easy to process, easy to operate, easy to clean and other characteristics.
Product Principle
The multifunctional laser-protection fluid prevents cutting spatter from damaging wafer surfaces. Its heat-dissipation, thermal-barrier and cooling properties reduce thermal effects, keep debris off the wafer and limit kerf widening. It can be removed quickly and cleanly after cutting.
Application Field
Widely used for cutting, drilling, welding, surface treatment and semiconductor processing in semiconductor, automotive, aerospace, electronics, lithium-battery, solar-panel, non-ferrous-metal and precision-machinery industries.
Product Principle
1. Good adaptability to laser cutting, improving cutting quality and machining accuracy, straight edges;
2. No cutting slag, smooth surface of the workpiece, no need for auxiliary cleaning;
3. Good trimming quality, no cracks, smooth cutting surface and no burrs;
4. Does not scratch the surface of the workpiece;
5. The cutting heat-affected zone is small, the cutting gap is narrow, and the material is saved;
6. Avoid damage to the lens of the laser equipment by splashes;
7. Convenient operation, friendly to human body and environment.
Usage Process
The laser protection solution is evenly distributed on the surface of the wafer (LED or semiconductor) after laser cutting by spraying or coating.
Parámetros del producto
●Viscosity (CP): 40-60
Packaging and storage
●1 gallon/pot, storage period is two years, can not be stored in the open air, to prevent sun and rain.
Notice
●Unused cutting fluid should be tightened to avoid moisture, oil and impurities.
Shenzhen Xintianma Electronics Co., Ltd.
Factory Address: Longhua Guanlan Yijia Science and Technology Park, Shenzhen
Sales office: A8, Yuan Chuangyuan Technology Park, Fuhua Road, Guanlan, Longhua District, Shenzhen.
Tel: 0755-83984291 83984293
Fax: 0755-22141459
EMAIL：cnxtm@cnxtm.cn
Website: http://www.cnxtm.cn
